Submission Type:
Article in Special Issue (note in cover letter)
Cover Letter:
Dear Editor-in-Chief,
Please find enclosed the revised version of our manuscript, “Integrating Neurosymbolic Systems in Advanced Product Design: A Comprehensive Review,” submitted to Neurosymbolic Artificial Intelligence for inclusion in the special issue "Special Call for Survey Papers".
We thank the Editor and reviewers for their constructive comments. We have carefully addressed all comments and substantially strengthened the manuscript. In particular, the revision expands the systematic literature search and engineering coverage, adds quantitative and cross-type analyses of the reviewed systems, introduces a more concrete evaluation framework, strengthens the discussion of reproducibility and industrial deployment, and revises the risks and challenges around product-design-specific technical, operational, and governance concerns. We have also updated the figures, tables, references, and accompanying ORKG comparison accordingly.
A detailed point-by-point response describing all changes is provided with the revised submission.
We thank you and the reviewers for your time and consideration, and we hope that the revised manuscript addresses all reviewer concerns and is now suitable for publication.
Yours sincerely,
Siamak Ghodsi
on behalf of all authors
L3S Research Center & TIB
Leibniz University Hannover
ghodsi@l3s.de